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Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits

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Book Details

Contributors
Author Edited By Shyam P. Murarka Moshe Eizenberg David B. Fraser Roland Madar Raymond Tung
Dimensions
Width 6.10 inch
Height 1.30 inch
Weight 930 g
Format
Binding Hardcover
Overview
Number of Pages 560 Pages
Series Name MRS Proceedings
Publisher Materials Research Society
Publication Year 1998
ISBN-13 9781558994201
ISBN-10 1558994203
Language English
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