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Embedded Systems: Design, Analysis and Verification: 4th Ifip Tc 10 International Embedded Systems Symposium, Iess 2013, Paderborn, Germany, June 17-1

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Book Details

Dimensions
Width 6.14 inch
Height 0.88 inch
Weight 694 g
Format
Binding Hardcover
Overview
Number of Pages 370 Pages
Publisher Springer
Publication Year 2013
ISBN-13 9783642388521
ISBN-10 3642388523
Language English
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