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Effect of Cooling Rate, Silver Composition, Dwell Time and Solder Joint Size on the Reliability of Tin-Silver-Copper Solder Joints.

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Book Details

Contributors
Author Mulugeta Abtew
Dimensions
Width 8.00 inch
Height 0.43 inch
Weight 340 g
Format
Binding Paperback
Overview
Number of Pages 166 Pages
Publisher "Proquest, Umi Dissertation Publishing"
Publication Year 2011
ISBN-13 9781244601871
ISBN-10 124460187X
Language English
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Effect of Cooling Rate, Silver Composition, Dwell Time and Solder Joint Size on the Reliability of Tin-Silver-Copper Solder Joints. Price in India

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